Innovative lamination process
for flexible electronics and LED technology
On course for innovation
Since the company was founded in 2005, LUMITRONIX® has steadily expanded its manufacturing expertise. Always open to innovative technologies, the company has consistently invested in production, the centrepiece of the business. From the very beginning, production in Hechingen has met the highest quality standards and utilised the latest technologies. In 2018, the production of rigid electronic assemblies was expanded to include a new production line for flexible electronics. The new line is now used to produce flexible electronic assemblies using the roll-to-roll process for the entire industry.
However, mechanical flexibility often goes hand in hand with physical stress. In demanding applications, the flexible modules must be able to reliably withstand the stress in the respective application. To meet this challenge, LUMITRONIX® recently established an innovative production process to make flexible electronics more robust for challenging applications: LumProtect®.
Safe protection for LED modules
LumProtect offers reliable protection against a wide range of environmental influences. Whether solar radiation, wind or water - the modules can withstand any weather and can therefore be used outdoors for flexible lighting solutions, for example. The lamination also protects the flex module against various chemicals from the air (e.g. exhaust fumes) or direct contact with the surface (e.g. paint, cleaning agents, dust). Mechanical stresses, such as direct contact with the electronics by the user, can also be largely avoided. Despite the lamination, the flexibility of the assembly is retained, so that multi-dimensional installations remain possible.
Protection against moisture
gases, dust and other particles
physical stress and
The lamination process
In the new production facility, both flat and linear electronic assemblies are laminated with multiple polymer materials. Depending on the intended use, the material composition can be adjusted. The lamination process involves applying multiple layers of plastic to the front and back of the flexible circuit board material using heat and pressure.
The components fitted on the flexible circuit board are encapsulated in this process, eliminating any air residue in the material composite. Since only very thin layers are used, the flexibility of the module is retained and at the same time the mechanical resistance increases significantly. The high transparency of the materials used makes the innovative technology a perfect addition to assemblies with LEDs or optical sensors.
Structured or smooth surfaces possible
High dielectric strength
High material transparency
Hardly any colour shifts
Different designs and colours possible with optional textile layers
Various connection and sealing options with cables, plugs, eyelets & crimp contacts
Features of the unique technology
LumProtect in comparison
In addition to LumProtect®, there are three common methods that are used to protect sensitive electronics. In our brochure we compare the aspects of protection and flexibility and look at the optical and mechanical properties in detail.