Fischer Elektronik heat-conducting adhesive (2x2ml), WLK DK 4
The heat-conducting adhesive from Fischer Elektronik is suitable for the safe and thermal bonding of electronic components such as high-power LEDs or mechanical components. It is a temperature-resistant, impact-resistant, solvent-free and thermally conductive epoxy-based two-component adhesive filled with aluminium oxide with a short pot life. The heat-conducting adhesive bonds porous and non-porous surfaces of metals, glass, ceramic materials and almost all plastics. The mixing (1:1) of hardener and binder is done by a static mixing tube with Luer-Lock system.
- thermal conductivity 1 W/mK
- mixing ratio: 1:1
- temperature range: -50° C to +145° C
- Curing: approx. 16 hours at room temperature, 4 hours at 60° C .
- Further processing: after approx. 4-6 hours (depending on layer thickness)
scope of delivery
- 1x 4 ml syringe
- 3x mixer WLK M 4
Application note: Apply as little heat-conducting adhesive as possible. The thermal conductivity of the adhesive is better than air, but worse than that of the heat sink. The more of the object to be cooled is placed directly on the heat sink, the better. In addition, make sure that the mixing ratio of 1:1 is kept as accurate as possible, otherwise the paste will not harden or will only harden very slowly.Translated with www.DeepL.com/Translator